Many people think that a slow deposition rate is due to a poor formulation of the electroless nickel plating solution. In fact, there are many factors that affect the deposition rate of the plating solution, including proper maintenance of the bath. When maintenance is not done well, the plating solution is easily contaminated by impurity ions, which will affect the deposition rate. In this article, we will share related content.
Excessive impurity ion content in the plating solution
During use, it is necessary to prevent the plating solution from being contaminated by impurities such as lead, tin, cadmium, chromic acid, sulfides, and thiosulfates. These impurities are poisons to the catalytic reaction of electroless nickel plating.
If these impurities are present in only small amounts in the plating solution, they will reduce the deposition rate of the electroless nickel plating solution. If their content is relatively high, it will cause the plating solution to fail.
If it is determined that the slow plating rate is caused by excessive impurity ion content, low current density electrolysis can be used to remove them.
So, how can we ensure that the plating solution is not contaminated by impurities? As an electroless nickel plating solution manufacturer that has been assisting electroplating plants in solving production problems for ten years, Bigely believes that the following three points need to be done well:
① The plating solution must be kept clean, and the tank should be covered. It is usually necessary to filter the solution once per work shift.
② The acid-resistant rubber at the bottom of the tank should be taken out every day and soaked in 1:1 nitric acid to remove sponge-like nickel particles.
③ The plating solution should be periodically removed, and 1:1 nitric acid should be poured into the tank overnight to dissolve and remove deposits on the tank walls, followed by thorough rinsing with water.
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