The influence of bath fluid control on electroless copper plating

2026-05-29 09:03:02

In order to achieve high-quality coating, what should we pay attention to when using the electroless copper plating solution?

The answer is that proper control of the bath solution is necessary. The control of the bath solution involves many aspects. Among them, the control of component concentration, the control of bath temperature, the pre-treatment and stirring filtration of electroless copper plating, etc. are particularly important. Let's focus on these aspects.

Control of component concentration

Since the operation of the electroless copper plating solution is different from that of the electroplating copper solution, in order to ensure that the deposition reaction can proceed smoothly, the concentrations of copper salts, sodium hydroxide and other components in the plating solution need to reach specific levels and should be in a balanced state. So, how to do it? The following 2 principles can be followed:

① Regularly conduct chemical analysis of the plating solution composition and promptly replenish the missing components.

② The supplementary components of the plating solution must be added in the quantities specified in the manual (which will be provided by the chemical manufacturer).

Control of bath temperature

The temperature of the electroless copper plating solution must be appropriate and should be controlled within 55-65℃ (for pre-copper plating). In the electroless copper plating solution, temperature control and heating devices are usually set up to control the temperature. We recommend using Teflon heaters (with low watt density) and Teflon steam coils (with low pressure steam).

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