When using electroless copper plating solutions, what factors affect the quality of the copper plating? First, we need to clarify what aspects constitute plating quality. From a practical production perspective, it generally includes deposition rate and plating solution stability. In this article, we will first discuss the factors that influence the deposition rate.
The concentration of the main salt significantly affects the deposition rate of the electroless copper plating solution. At low formaldehyde concentrations, the reducing power is weak, resulting in a slow deposition rate. However, once its concentration rises to a certain level, it no longer affects the deposition rate. Nevertheless, it is closely related to the pH value of the plating solution.
The reducing effect of formaldehyde is related to the pH value of the plating solution; it possesses the ability to reduce copper only under alkaline conditions where pH > 11. The higher the pH of the plating solution, the stronger the copper-reducing effect of formaldehyde and the faster the plating speed.
However, if the pH value of the plating solution is too high, it can easily lead to the spontaneous decomposition of the plating solution, thereby reducing its stability. Therefore, the pH value of most electroless copper plating solutions is controlled at around 12.
When using Bigely electroless copper plating solution, increasing either the formaldehyde or main salt concentration (within process limits) can enhance the copper plating rate, provided the solution's pH and other component concentrations remain constant.
About us
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, Bigely Technology is a national high-tech enterprise with a strong research and development team, which has over 10 engineers with more than 20 years' working experience in the electroplating industry.
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