When using the chemical copper plating solution, if no copper layer is deposited on the inner wall of the hole, apart from the incorrect concentration of the solution components, it may also be due to the failure to control the process parameters properly. Chemical copper plating is different from other processes. Even a slight error can easily lead to failure phenomena. Therefore, it is very necessary to understand other causes that may lead to such failures. This will help electroplating enterprises scientifically and accurately control each link and produce high-quality products.
Alkalinity
The chemical copper plating reaction can only proceed under a certain alkalinity. Since the stability constants of copper's coordination compounds vary with the alkalinity for different complexing agents, the alkalinity required by different complexation agent systems also differs.
When the alkalinity of the chemical copper plating solution is lower than the specified value (the alkalinity for thick copper plating should be controlled within 4.0 - 6.0 g/L), although the chemical copper plating reaction can proceed, defects such as pinholes or incomplete copper deposition in the metallization holes may occur in the plating layer. When the solution's alkalinity is too high, a rough copper plating layer will be produced, and the solution stability will deteriorate. Therefore, when electroplating enterprises use the chemical copper plating solution from Beggley, they need to adjust the solution's alkalinity according to the guidance of our engineers.
Stirring
During the production process of the chemical copper plating solution, stirring is an indispensable step. Its functions are mainly two: Firstly, it ensures that the concentration of the solution contacting the surface of the plated part is as consistent as that of the overall solution, thereby enabling sufficient divalent copper ions to be reduced to form the coating, thus increasing the deposition rate of the plating solution; Secondly, it enables the bubbles remaining on the surface of the plated part to quickly detach and escape from the liquid surface, thereby reducing the bubble formation of the coating and improving the quality of the coating. In addition, stirring can also make the thickness of the coating uniform.
About us
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating chemicals. As a fast growing electroplating chemicals supplier in China, Bigely has over 20 years' experience in electroplating additives production and own production base of 5000 square meters. We can produce 15,000 tons of electroplating additives every year, which can fully meet the needs of customers.
If you need our high-quality electroplating additives, please contact us. We can provide you samples for test, and also provide a series of services.
