When electroless copper plating solution is used, what are the causes of solid catalytic particles in the plating solution?

When electroless copper plating solution is used, what are the causes of solid catalytic particles in the plating solution?

Mon Feb 26 10:16:12 CST 2024

When we use electroless copper plating solution, if there are solid catalytic particles in the plating solution, it will affect the deposition of the coating, therefore, we need to understand the causes, so as to avoid such phenomena.

(1) After the surface activation treatment of the plating, it is not thoroughly cleaned, and metal particles such as silver and palladium, especially the silver and palladium ions are brought into the electroless copper plating solution to become the catalytic center of copper, and are prefered to be reduced, which will soon decompose the solution.

(2) Particles falling off from the plating electroless copper plating process, sometimes the deposited copper layer is relatively loose, may fall from the plating, these copper particles will accelerate the self-catalytic reaction of electroless copper plating solution, but also make the solution decompose.

(3) When the drug preparation of the chemical bath is not pure, it will bring in some metal impurities that have catalytic activity for copper. For example, impurious tartrate contains colloidal insoluble particles, which can also cause the solution to be unstable. Some drugs contain iron salts, if the iron content is more than 15mg/L, it will affect the stability of the bath.

(4) The electroless copper plating container must be clean, if the decomposed electroless copper plating container is filled, the reformulated plating solution must be cleaned, or even thoroughly cleaned by chemical method, otherwise it is difficult to clean the fine particles of the catalyst from the container gap. Once they enter the newly formulated solution, they will accelerate the autocatalytic reaction of the bath.

In actual production, in order to maintain and even improve the deposition rate of the coating, we need to use Bigelay electroless copper plating liquid, its deposition rate is fast, thick copper plating, the rate can reach 4-7 mm per hour, and the copper plating layer is detailed, uniform and smooth.

If you need electroless copper plating solution, please feel free to contact us.