In the production of copper pyrophosphate plating process, if the pH value is high, it often affects the quality of the coating. Therefore, we need to know what are the causes of high pH value.
1. Imbalance in the composition of the plating solution: There may be an imbalance between the acid and alkaline components of the plating solution, resulting in an increase in the pH of the plating solution. The initial ratio of the plating solution and the proportion of additives need to be accurately blended to ensure that the pH remains within the desired range.
2. Excessive alkaline additives: If too much alkaline material (e.g., pyrophosphates) is accidentally added to the plating solution, this will directly lead to an increase in pH.
3. Low concentration of copper ions in the plating solution: During the plating process, copper ions are continuously deposited on the substrate by reduction. If copper ions are not replenished in a timely manner, the content of copper ions in the plating solution will decrease, which may also lead to an increase in pH because the lack of copper ions reduces the acidic reaction in the plating solution.
4. Improper operation or maintenance of the plating solution: For example, if the temperature of the plating solution is not properly controlled, or if the plating solution is not properly agitated during use, the pH may be elevated.
5. Contamination: The plating bath may be contaminated with contaminants that enter the bath and can cause pH changes. For example, volatile alkalis or other chemicals from indoor air may dissolve into the bath.
Response:
The pH of the plating solution for the pyrophosphate copper plating process is regularly tested and adjusted according to operating conditions and production requirements.
Maintain proper ratio of plating solution components to ensure accurate and timely dosing.
Add an appropriate acid (e.g. sulfuric acid) to the plating solution to lower the pH.
Ensure that the concentration of copper ions in the plating solution is stable, and maintain the proper level by periodically replenishing copper salts.
Maintain proper plating solution temperature and agitation to ensure uniform distribution of plating solution components.
Avoid contamination of the plating solution and take measures to reduce potential sources of contamination.
Please note that when adjusting the process parameters of the plating solution, especially the pH value, when using Bigely copper pyrophosphate brightener, we should do so carefully and step by step, as over-adjustment may affect the quality of the plated layer or cause other problems. The adjustment process requires not only a certain amount of technical experience, but also a good knowledge of the plating additives you are using. For this reason, our technical engineers provide technical support to our customers.
If you have any demands for copper pyrophosphate brightener, please feel free to contact us.
